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IRS254(01,11)(S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The
thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min Max Units
V B
High-side floating well supply voltage
IRS25401 -0.3 225
IRS25411 -0.3 625
V S
High-side floating well supply return voltage V B + 0.3 V B + 0.3
V HO
Floating gate drive output voltage V S – 0.3 V B + 0.3
V
V LO
V IFB
V ENN
I CC
Low-side output voltage -0.3 V CC + 0.3
Feedback voltage -0.3 V CC + 0.3
Enable voltage -0.3 V CC + 0.3
Supply current (?) -20 20 mA
dV/dt Allowable offset voltage slew rate -50 50 V/ns
P D
R Θ JA
Package power dissipation @ T A ≤ +25 oC
P D = (T JMAX -T A )/R THJA
Thermal resistance, junction to ambient
(8-Pin DIP) --- 1
(8-Pin SOIC) --- 0.625
(8-Pin DIP) --- 125
(8-Pin SOIC) --- 200
W
oC/W
T J
Junction temperature -55 150
T S
Storage temperature -55 150
oC
T L Lead temperature (soldering, 10 seconds) --- 300
? : This IC contains a zener clamp structure between the chip V CC and COM, with a nominal breakdown voltage
of 15.6 V. Please note that this supply pin should not be driven by a low impedance DC power source greater
than V CLAMP specified in the electrical characteristics section.
Recommended Operating Conditions
For proper operation the device should be used within recommended conditions.
Symbol Definition Min Max
Units
V BS
High-side floating supply voltage V CC -0.7 V CLAMPHS
V S
Steady state high-side floating supply offset
voltage
IRS25401 -1 200
IRS25411 -1 600
V
V CC
Supply voltage V CCUV+
V CLAMP
I CC
Supply current -Note 2 10
T J Junction temperature -25 125
?? : Sufficient current should be supplied to V CC to keep the internal 15.6 V zener regulating at V CLAMP .
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? 2010 International Rectifier
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